A porcelain socket is fired at anything up to 2500 deg. F to vitrify the body. The purpose of glazing the socket surface (which is carried out at a lower temperature) is to prevent surface contamination which could decrease the resistance to breakover from surface contamination. Because the initial firing fuses the materials within the ceramic body, the material is impervious to moisture absorption, hence for many sockets only the upper surface is glazed.
Unless contaminated the porcelain has a high resistance to electrical breakdown. However, arcing in close proximity can reach temperatures in the tens of thousands of degrees. This localised temperature deposits metallic and carbon particles onto the surface of the ceramic, maintaining the discharge. More importantly, the glazed surface melts and metallic oxides are highly soluble in molten glass (in fact many coloured glazes are composed of metallic oxides). The abrupt nature of a breakdown also means that micro-fractures can be created through the material, on or near the surface, and these can in turn be contaminated and form conductive pathways.
Now, if that material is cleaned and put back into service there is still the possibility of surface contamination through;
1. Microscopic carbon and metallic particles deposited on the surface
2. The presence of dissolved metallic oxides within the fringes of any remaining glaze or within any momentarily liquified porcelain.
3. The presence of contaminated micro-fractures.
There's an interesting property of a spark gap; if two energised electrodes are spaced such that they are just beyond the breakdown voltage of that gap, then another (electrically isolated) conductive point interposed between the electrodes will cause a discharge within that gap. Once initiated an arc can still be maintained even if the voltage is reduced well below the breakdown voltage of the gap.
So, why is this relevant? The particles which remain on an arced porcelain socket act as numerous interposer points and reduce the breakdown capacity between the socket pins, making failure more likely in the future. As the breakdown of any gap is more likely (for a given voltage) with an abrupt voltage change rather than a gradual one, the socket is more likely to fail again under stressed conditions than steady state conditions.
So, a cleaned socket may work for a while until the gap is electrically stressed. Now, the question is, would the stress be within normal operating conditions, or would that stress be caused by the fault that caused the breakdown in the first place?
Unless contaminated the porcelain has a high resistance to electrical breakdown. However, arcing in close proximity can reach temperatures in the tens of thousands of degrees. This localised temperature deposits metallic and carbon particles onto the surface of the ceramic, maintaining the discharge. More importantly, the glazed surface melts and metallic oxides are highly soluble in molten glass (in fact many coloured glazes are composed of metallic oxides). The abrupt nature of a breakdown also means that micro-fractures can be created through the material, on or near the surface, and these can in turn be contaminated and form conductive pathways.
Now, if that material is cleaned and put back into service there is still the possibility of surface contamination through;
1. Microscopic carbon and metallic particles deposited on the surface
2. The presence of dissolved metallic oxides within the fringes of any remaining glaze or within any momentarily liquified porcelain.
3. The presence of contaminated micro-fractures.
There's an interesting property of a spark gap; if two energised electrodes are spaced such that they are just beyond the breakdown voltage of that gap, then another (electrically isolated) conductive point interposed between the electrodes will cause a discharge within that gap. Once initiated an arc can still be maintained even if the voltage is reduced well below the breakdown voltage of the gap.
So, why is this relevant? The particles which remain on an arced porcelain socket act as numerous interposer points and reduce the breakdown capacity between the socket pins, making failure more likely in the future. As the breakdown of any gap is more likely (for a given voltage) with an abrupt voltage change rather than a gradual one, the socket is more likely to fail again under stressed conditions than steady state conditions.
So, a cleaned socket may work for a while until the gap is electrically stressed. Now, the question is, would the stress be within normal operating conditions, or would that stress be caused by the fault that caused the breakdown in the first place?
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