I've got an Eden WT-800 on the bench with intermittent connections on the front panel PCB. Later generation unit, having the 'properly built' amp modules (if ya wanna call them that) and better constructed front panel board. Once I got the board out and had a look at all the rear panel I/O headers, and all the front panel pots, I kinda wanted to heave. Cold solder joints everywhere on the headers....of course the type that when heated back up, the pins melt the plastic and want to fall over, mis-align, come out.....Methode parts?? Ain't Molex! Gotta have mating connectors installed to keep the pins in place while dealing with the de-solder / re-solder process. Cold solder joints on all the pots, though most of the components flow-soldered look ok.
Right Channel on the Master Volume either has a gritty wiper that won't exercise out, or I have DC on the pot....but hadn't yet determined that. Figured I'd do some board maintenance, and sure looks like it needs it.
Then, I find whoever installed the pots used like 18" of solder----just kept pouring it on...and on....and on....and on. So, no way...absolutely no way to remove it all from the bottom side without lifting the pads. Went to remove a pair of caps in the way to gain access to the 'inside' of the dual-gang pot, and ......my PACE SX-70 DeSoldering Iron was rendered useless. Wouldn't heat up common component lead solder pads. OH GREAT! LEAD-FREE SOLDER!!!
Or.....how to NEVER NEVER EVER EVER EVER EVER ALLOW A DE-SOLDERING IRON TO WORK!! I HATE that C*#P!!! And looking at the headers, my blood pressure shot up.
What is the technique for using a well-maintained PACE De-Soldering Iron and this Lead-Free solder on PCB pads that WILL fail if you crank up the heat to melt the solder? I'm already patching the damage on the Master Volume from their application of 18" worth of lead free solder.
Sometimes, saying yes on a problem child just makes ya wonder what did ya do wrong to deserve this!
Right Channel on the Master Volume either has a gritty wiper that won't exercise out, or I have DC on the pot....but hadn't yet determined that. Figured I'd do some board maintenance, and sure looks like it needs it.
Then, I find whoever installed the pots used like 18" of solder----just kept pouring it on...and on....and on....and on. So, no way...absolutely no way to remove it all from the bottom side without lifting the pads. Went to remove a pair of caps in the way to gain access to the 'inside' of the dual-gang pot, and ......my PACE SX-70 DeSoldering Iron was rendered useless. Wouldn't heat up common component lead solder pads. OH GREAT! LEAD-FREE SOLDER!!!
Or.....how to NEVER NEVER EVER EVER EVER EVER ALLOW A DE-SOLDERING IRON TO WORK!! I HATE that C*#P!!! And looking at the headers, my blood pressure shot up.
What is the technique for using a well-maintained PACE De-Soldering Iron and this Lead-Free solder on PCB pads that WILL fail if you crank up the heat to melt the solder? I'm already patching the damage on the Master Volume from their application of 18" worth of lead free solder.
Sometimes, saying yes on a problem child just makes ya wonder what did ya do wrong to deserve this!
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