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Sold in packs of 10 Silicone/Kapton pad used to provide better heat conductivity & Dielectric isolation between heatsink/mounting Base and a TO-3 case device.. Thermal Conductivity: 0.9 W/m-k Thermal Performance: 3.4deg.C°/W @ 25PSI Dielectric Breakdown: 6000VAC L: 1-5/8 W: 1-1/8 T: .006 WT: .001/Pack of 10
soldering stuff that's broken, breaking stuff that works, Yeah!
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